Such a "cream solder" has been extensively used in soldering electronic components to printed circuit boards.Ī reflow furnace as an apparatus for soldering chip-mounting printed circuit boards has been known. The term "cream solder" as used herein means a creamy substance that is formed by mixing solder in powder form and a liquid flux and which can be deposited in a given amount on selected locations by means of a screen printing apparatus or a dispenser. The present invention relates to a tunnel-type reflow furnace, in particular, to a cream solder melting tunnel-type reflow furnace which is furnished with a plurality of heaters on both the top and bottom of the tunnel and which consists of a preheating and a main heating zone. A tunnel-type cream solder melting reflow furnace according to claim 4 wherein the infrared heaters are far-infrared heaters. A tunnel-type cream solder melting reflow furnace according to claim 4 wherein the gas blown from the nozzle is nitrogen gas.Ħ. A tunnel-type cream solder melting reflow furnace comprising a preliminary heating zone and a main heating zone which is furnished with at least two pairs of infrared heaters disposed on both a top and bottom of a tunnel providing a pathway for the transfer of a printed circuit board carrying electronic components to be heated, said infrared heaters being of a gas-blowing type, each comprising an electric heater in a heater housing, a gas supply system for supplying a gas into the housing, and a gas-permeable ceramic heating surface disposed on the side of the housing which faces the printed circuit board to be heated and a gas-blowing nozzle that is freely adjustable to determine the direction of gas blowing being provided between infrared heaters on both the top and bottom of the tunnel.ĥ. A tunnel-type cream solder melting reflow furnace according to claim 1 wherein the infrared heaters are far-infrared heaters.Ĥ. A tunnel-tye cream solder melting reflow furnace according to claim 1 wherein the gas blown from the nozzle is nitrogen gas.ģ. A tunnel-type cream solder melting reflow furnace comprising a preliminary heating zone and a main heating zone which is furnished with at least two pairs of infrared heaters disposed on both a top and bottom of a tunnel providing a pathway for transfer of a printed circuit board carrying electronic components to be heated, said infrared heaters being of a gas-blowing type, each comprising an electric heater in a heater housing, a gas supply system for supplying a gas into the housing, and a gas-permeable ceramic heating surface disposed on the side of the housing which faces the printed circuit board to be heated.Ģ.
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